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 AP2306N
Advanced Power Electronics Corp.
Capable of 2.5V gate drive Lower on-resistance Surface mount package
S D
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
BVDSS RDS(ON) ID
20V 32m 5.3A
Description
SOT-23
G
Advanced Power MOSFETs utilized advanced processing techniques to achieve the lowest possible on-resistance, extremely efficient and cost-effectiveness device. The SOT-23 package is universally used for all commercial-industrial applications.
D
G S
Absolute Maximum Ratings
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Symbol VDS VGS ID@TA=25 ID@TA=70 IDM PD@TA=25 TSTG TJ
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current , VGS @ 4.5V Continuous Drain Current , VGS @ 4.5V Pulsed Drain Current
1,2 3 3
Rating 20 12 5.3 4.3 10 1.38 0.01 -55 to 150 -55 to 150
Units V V A A A W W/
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-a Parameter Thermal Resistance Junction-ambient
3
Value Max. 90
Unit /W
Data and specifications subject to change without notice
200509032
AP2306N
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS
BVDSS/Tj
Parameter Drain-Source Breakdown Voltage
Test Conditions VGS=0V, ID=250uA
Min. 20 0.5 -
Typ. 0.1 13 8.7 1.5 3.6 6 14 18.4 2.8 603 144 111
Max. Units 27 32 50 90 1 10 100 V V/ m m m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=5.5A VGS=4.5V, ID=5.3A VGS=2.5V, ID=2.6A VGS=1.8V, ID=1.0A
VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=55 C)
o o
VDS=VGS, ID=250uA VDS=5V, ID=5.3A VDS=20V, VGS=0V VDS=16V ,VGS=0V VGS= 12V ID=5.3A VDS=10V VGS=4.5V VDS=15V ID=1A RG=2,VGS=10V RD=15 VGS=0V VDS=15V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2
Test Conditions IS=1.2A, VGS=0V IS=5A, VGS=0V, dI/dt=100A/s
Min. -
Typ. 16.8 11
Max. Units 1.2 V ns nC
Reverse Recovery Time
Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse width <300us , duty cycle <2%. 3.Surface mounted on 1 in2 copper pad of FR4 board ; 270/W when mounted on min. copper pad.
AP2306N
80
50
T A =25 o C
60
5.0V 4.5V 4.0V ID , Drain Current (A) V G =2.5V T A =150 o C
40
5.0V 4.5V
30
ID , Drain Current (A)
4.0V
20
40
20
V G =2.5V
10
0 0 1 2 3 4 5 6 7
0 0 1 2 3 4 5 6 7 8
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
1.8
I D =5.3A T A =25 o C
80 1.6
I D =5.3A V G =4.5V Normalized RDS(ON)
1.4
RDS(ON) (m )
60
1.2
1.0
40 0.8
20 1 3 5 7 9 11
0.6 -50 0 50 100 150
V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( o C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
1.6
100
1.4
10 1.2
T j =150 o C
IS (A)
1
T j =25 o C
VGS(th)(V)
1
0.8
0.6 0.1
0.4
0.01 0 0.4 0.8 1.2 1.6
0.2 -50 0 50 100 150
V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature (
o
C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
AP2306N
14 1000
f=1.0MHz Ciss
VGS , Gate to Source Voltage (V)
12
I D =5.3A V DS =16V
10
8
C (pF)
100
6
Coss Crss
4
2
10 0 0 5 10 15 20 25 1 5 9 13 17 21 25 29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (Rthja)
DUTY=0.5
0.2
10
0.1
0.1
1ms ID (A)
1
0.05
PDM
0.01
10ms
0.1
t T Duty factor = t/T Peak Tj = PDM x Rthja + Ta Rthja = 270 /W
0.01
Single Pulse
100ms T A =25 o C Single Pulse 1s DC
0.01 0.1 1 10 100
0.001
0.0001 0.001 0.01 0.1 1 10 100 1000
V DS , Drain-to-Source Voltage (V) t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
RD VDS
TO THE OSCILLOSCOPE
D D VDS
TO THE OSCILLOSCOPE
0.5 x RATED VDS
RG
G
0.75x RATED V +
G S VGS
+ 10 V -
S VGS
1~ 3 mA
I
G
I
D
Fig 11. Switching Time Circuit
Fig 12. Gate Charge Circuit


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